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Pyrolytic graphite application examples:
1. The heating rate of PG/PBN heater is extremely fast, and the outgassing rate is extremely low. This heating material is an ideal heating material for semiconductor industries and applications that require high vacuum, high temperature and high purity. For example: semiconductor substrate heating (MBE, MOCVD, PVD, CVD, etc.), superconductor substrate heating, rapid annealing furnace, electron microscope sample heating, metal evaporation heat source, gas heating nozzle heater, etc.
2. Pyrolytic graphite has outstanding characteristics such as low density, high temperature, high strength, good ablation resistance, and excellent thermal shock resistance. It is an ideal throat lining material for tactical missile engines.
3. Pyrolytic graphite is a very common ion beam grid preparation material, which has the characteristics of high purity, low corrosion rate and limited thermal expansion. The role of the ion beam grid is to extract the ions in the discharge chamber plasma through a series of electrostatic grids with many small holes in a precise arrangement.
4. PG crucible has the advantages of high purity, compactness, low air permeability (same as glass), high temperature resistance, acid and alkali corrosion resistance, resistance to sudden cooling and sudden heat changes, and easy washing. PG crucibles are superior to platinum, silver, nickel and other crucibles in some respects. Main market applications:
Application of standard samples and standard analysis methods
Preparation of high-purity metal oxides, ion plating and other fields
Smelting crucible for steaming aluminum in semiconductor industry
Evaporation vessels for OLED industry
PG coating application, through the coating method, reflects the characteristics of high density, low outgassing rate, corrosion resistance and oxidation resistance of pyrolytic graphite, and is widely used in the following fields:
In MOCVD equipment, graphite base coating for GaN epitaxial growth.
Graphite pedestal coating for monocrystalline silicon epitaxial growth, flat pedestal, circular pedestal, three-dimensional pedestal.
Graphite chassis coating for monocrystalline silicon device sintering furnace.
Surface coatings on graphite heaters (panel heaters, round heaters, cartridge heaters, etc.).
Graphite sagger coating for sintering in various oxide tunnel kilns.
Graphite base coating for powder metallurgy continuous sintering
The technical parameters of pyrolytic graphite are as follows:
Materials | LTPG |
Density | 2.2 g/cm3 |
Compressive strength | ≥ 85 Mpa (ab direction) |
tensile strength | ≥ 76 Mpa (ab direction) |
Impurity | ≤ 0.02 % |
Thermal conductivity | 0.9 K/cm.s.℃ (ab direction) |
5*10-3 K/cm.s.℃ (c direction) | |
Thermal expansion coefficient | 3.2*10-6/℃ (ab direction) |
Airtight | Helium transmittance ＜10-10 cm2 |
Inter-grain spacing | ≤ 3.42A |
Pyrolytic graphite application examples:
1. The heating rate of PG/PBN heater is extremely fast, and the outgassing rate is extremely low. This heating material is an ideal heating material for semiconductor industries and applications that require high vacuum, high temperature and high purity. For example: semiconductor substrate heating (MBE, MOCVD, PVD, CVD, etc.), superconductor substrate heating, rapid annealing furnace, electron microscope sample heating, metal evaporation heat source, gas heating nozzle heater, etc.
2. Pyrolytic graphite has outstanding characteristics such as low density, high temperature, high strength, good ablation resistance, and excellent thermal shock resistance. It is an ideal throat lining material for tactical missile engines.
3. Pyrolytic graphite is a very common ion beam grid preparation material, which has the characteristics of high purity, low corrosion rate and limited thermal expansion. The role of the ion beam grid is to extract the ions in the discharge chamber plasma through a series of electrostatic grids with many small holes in a precise arrangement.
4. PG crucible has the advantages of high purity, compactness, low air permeability (same as glass), high temperature resistance, acid and alkali corrosion resistance, resistance to sudden cooling and sudden heat changes, and easy washing. PG crucibles are superior to platinum, silver, nickel and other crucibles in some respects. Main market applications:
Application of standard samples and standard analysis methods
Preparation of high-purity metal oxides, ion plating and other fields
Smelting crucible for steaming aluminum in semiconductor industry
Evaporation vessels for OLED industry
PG coating application, through the coating method, reflects the characteristics of high density, low outgassing rate, corrosion resistance and oxidation resistance of pyrolytic graphite, and is widely used in the following fields:
In MOCVD equipment, graphite base coating for GaN epitaxial growth.
Graphite pedestal coating for monocrystalline silicon epitaxial growth, flat pedestal, circular pedestal, three-dimensional pedestal.
Graphite chassis coating for monocrystalline silicon device sintering furnace.
Surface coatings on graphite heaters (panel heaters, round heaters, cartridge heaters, etc.).
Graphite sagger coating for sintering in various oxide tunnel kilns.
Graphite base coating for powder metallurgy continuous sintering
The technical parameters of pyrolytic graphite are as follows:
Materials | LTPG |
Density | 2.2 g/cm3 |
Compressive strength | ≥ 85 Mpa (ab direction) |
tensile strength | ≥ 76 Mpa (ab direction) |
Impurity | ≤ 0.02 % |
Thermal conductivity | 0.9 K/cm.s.℃ (ab direction) |
5*10-3 K/cm.s.℃ (c direction) | |
Thermal expansion coefficient | 3.2*10-6/℃ (ab direction) |
Airtight | Helium transmittance ＜10-10 cm2 |
Inter-grain spacing | ≤ 3.42A |
